DEUTSCH

ESPAÑOL

POLSKI

FIND A DISTRIBUTOR NEAR YOU

CURRENT PRICES
& CATALOGS FOR
ONLINE ORDERING

LITERATURE

RE-ORDER PRODUCTS
FOR CMP HERE

STONE

CONCRETE

CRYSTALITE /
LAPIDARY

DENTAL

GLASS

COMPOSITES

OPTICAL

METAL REMOVAL

AIRCRAFT ENGINE
COMPONENTS

WEAR PARTS

PCD TOOLING

COMBINATION
TOOLING

DRESSING
MACHINES

DRESSING
TOOLS

Infinity v6.1™
Optimized Pad
Conditioners
Performance pays with
Abrasive Technology's CMP products

The Global Leader in CMP Pad Conditioners

Leading Innovations Deliver Best in Class CMP Pad Conditioners

Abrasive Technology's diamond CMP (chemical mechanical planarization) pad conditioners are precisely manufactured for the highest productivity in semiconductor wafer processing. As the electronics and semiconductor industries thrive, Abrasive Technology stands committed to exceeding the CMP needs of the world's major semiconductor device manufacturers, and semiconductor equipment manufacturers.

Abrasive Technology offers a leading-edge bonding system that outshines competitors' products to achieve the highest quality standards. What makes our CMP pad conditioners the best in class? The P.B.S.® bonding system.

The P.B.S.® Brand Advantage

Traditionally, CMP pad conditioners have been constructed using electroplated nickel as the bonding medium between diamond crystals and the substrate. However, this bonding method is prone to crystal loss during the CMP pad conditioning process. That's where Abrasive Technology's patented process (US Patent No. 5,511,718) comes into play. Abrasive Technology offers this unique process to increase crystal retention while at the same time creating a tool that is more aggressive and far less prone to loading up with debris.

What this translates into for Abrasive Technology's worldwide
customers is
* Higher wafer yield
* Increased process reliability
* Lowest cost of ownership
* Profitability

Abrasive Technology's Global Presence

Technical innovation is the name of the game at Abrasive Technology. As the worldwide leader in superabrasive grinding and tooling, Abrasive Technology and its associates are strongly committed to designing, developing and manufacturing state-of-the-art products to meet the challenging needs of the semiconductor industry. With more than 30 years of superabrasive grinding expertise to its credit, the Company believes in global presence with 11 manufacturing locations around the globe to meet and ultimately exceed customer expectations.

More Information

To learn more about Abrasive Technology's CMP capabilities, please keep reading. We also welcome the opportunity to address your individual questions. You may contact us via email at: customerservice@abrasive-tech.com.

P.B.S.® Pad Conditioners
P.B.S.® Pad Conditioners for In-situ Metal CMP Processes
Infinity v6.1™ Optimized Pad Conditioners

Diamond CMP technical papers

Technical Papers and Product Brochure



WORLD
HEADQUARTERS

Lewis Center, Ohio U.S.A.
Ph.  1.740.548.4100
Fax: 1.740.548.7617

EUROPEAN
HEADQUARTERS
London, UK
Ph.  44.20.7471.0200
Fax: 44.20.7471.0202
ASIAN
HEADQUARTERS
Singapore
Ph.  65.62706878
Fax: 65 62706877
TAIWAN OFFICE
Taiwan
Ph. 886.963397769
Fax: 886.3.4328150
ISO 9001:2000 Certified © 2004 Abrasive Technology, Inc. All rights reserved.
Abrasive Technology Quality Statement